LOCTITE 3611 PDF

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Pin Transfer Use: After storage in a refrigerator the adhesive must be allowed to equlibrage to room temperature before use, typically 2 to 4 hours. Avoid cross contamination with other adhesive residues by ensuring dispense nozzles, adapter etc. The quantity of adhesive dispensed will depend on the pin type and size, depth pin dipped into adhesive and adhesive temperature.

These parameters will vary depending on type of dispensing system used and should be optimised accordingly. Under these conditions product will remain dispensable in the tray for at least 2 to 3 days and for up to five days with frequent replenishment of new material.

After storage in a refrigerator the adhesive must be allowed to equilibrate to room temperature before use, typically 2 to 4 hours. Higher temperatures will decrease the viscosity and will effect the printing results. The quality of the print results will depend on board support, print gap, print speed, print pressure and separation speed.

Rate of cure and final strength will depend on the residence time at the cure temperature. Alcohols e. Isopropanol can cure the adhesive and may lead to blocked apertures if left on the stencil for over 5 minutes. Automatic under-stencil-wipe is not recommended. Cured adhesive can only be removed mechanically with the aid of heat. Designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering.

It is specially formulated to have excellent moisture resistance and high adhesion to SMT components encapsulated in low stress molding compounds.

It is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where medium to high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required. High speed stencil print adhesive. Particularly suited to printing a range of dot heights with one stencil thickness and where high wet strength characteristics, and high print speeds are required.

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Consult the relevant manufacturer's website and product data sheet for more information. Please test and evaluate materials carefully to ensure compliance with all specifications and requirements of your application. We have no control over the conditions of use of materials, so even if you use the Ask an ESR feature it is solely up to you to independently determine the efficacy, suitability, performance and safety of the material for your application.

All rights Reserved. You will lose your saved materials unless you register. Please register. Need help? Our knowledgeable experts help you achieve your goals by giving you application insights. They are available personally to help you before, during or after your search. Toggle navigation. Key Specs. More Filters. Home Henkel Loctite Henkel Loctite Summary Tech Specs Best Practices Comparables Description for Henkel Loctite Designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering.

Particularly suited where very fast cure is required on high speed SMT lines. Save This Material Saved Items 0. Technical Data for Henkel Loctite Material Form Gel - Viscous gel. Chemistry Epoxy. Application Method Other - Pin transfer, Stencil print. Cure Method Heat - Heat cure. Color Red. Brand Loctite. Storage information may be indicated on the product container labeling.

Material removed from containers may be contaminated during use. Do not return product to the original container. Henkel Corporation cannot assume responsibility for product which has been contaminated or stored under conditions other than those previously indicated.

Application Pin Transfer Use: After storage in a refrigerator the adhesive must be allowed to equlibrage to room temperature before use, typically 2 to 4 hours. Removal Cured adhesive can only be removed mechanically with the aid of heat. Loctite Henkel Designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Loctite Henkel It is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering.

Loctite Henkel High speed stencil print adhesive. Questions about this material? Your Profile Edit. Which answer best describes a project you are currently working on? Popular Articles. Don't Leave! View Loctite now. View data now No, Thank You. No I need more info. Yes Ok, great! Message sent - We'll get back shortly. Remember Me Forgot Password?

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